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SL2541B DA102 IN74A 1207A DM9374 04741 ECCM2 B0515
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  ?2015 littelfuse, inc. specifcations are subject to change without notice. 552 tvs diode arrays (spa ? diodes) revision: 04/01/15 tvs diode arrays (spa ? diodes) general purpose protection - SP1014 series SP1014 series description pinout functional block diagram 1 2 life support note: not intended for use in life support or life saving applications the products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. rohs pb green SP1014 series 6pf 12kv bidirectional discrete tvs 12 0201 f lipchip note: drawing not to scale 1 pin1 pin2 the SP1014 includes back-to-back zener diodes which provides protection for electronic equipment that may experience destructive electrostatic discharges (esd). it measures 0.52 x 0.27mm permitting use of the standard 0201 footprints, but offering a 30% reduction in occupied board space. the SP1014 can safely absorb repetitive esd strikes above the maximum level specifed in the iec61000-4-2 international standard (level 4, 8kv contact discharge) without performance degradation, and the back-to-back confguration provides symmetrical standoff voltage which makes the component appropriate for use when ac signals are present on the data or signal line. applications features ? esd, iec61000-4-2, 12kv contact, 15kv air ? eft, iec61000-4-4, 40a (5/50ns) ? lightning, iec61000-4-5, 2a (t p =8/20s) ? low capacitance of 6pf (@ v r =0v) ? low leakage current of 5na at 1.5v ? mobile phones ? smart phones ? tablets ? wearable technology ? portable medical ? digital cameras ? mp3/pmp ? portable navigation devices ? point of sale terminals
?2015 littelfuse, inc. specifcations are subject to change without notice. 553 tvs diode arrays (spa ? diodes) revision: 04/01/15 tvs diode arrays (spa ? diodes) general purpose protection - SP1014 series SP1014 series notes: 1. caution: stresses above those listed in absolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specifcation is not implied. absolute maximum ratings symbol parameter value units i pp peak current (t p =8/20s) 2.0 1 a t op operating temperature -40 to 125 c t stor storage temperature -55 to 150 c electrical characteristics (t op =25 o c) parameter symbol test conditions min ty p max units reverse standoff voltage v rwm i r 1 a with 1 pin to gnd 5.0 v reverse breakdown voltage v br i t =1ma with 1 pin at gnd 7. 0 v leakage current i leak v r = 1. 5 v with 1 pin at gnd 1 5 na v r = 3.3 v with 1 pin at gnd 1 10 na v r = 5 v with 1 pin at gnd 1 100 na clamp voltage 1 v c i pp =1a, t p =8/20s, fwd 10 v i pp =2a, t p =8/20s, fwd 11 v dynamic resistance 2 r dyn tlp t p =100ns, 1 pin to gnd 0.5 ? esd withstand voltage 1 v esd iec61000-4-2 (contact discharge) 12 kv iec61000-4-2 (air discharge) 15 kv diode capacitance 1 c d reverse bias=0v, f=1mhz 6 7 pf note: 1parameter is guaranteed by design and/or device characterization. 2 transmission line pulse (tlp) test setting : std.tdr(50),tp=100ns, tr=0.2ns itlp and vtlp averaging window: star t1=70ns to end t2=80ns thermal information parameter rating units storage temperature range -55 to 150 c maximum junction temperature 150 c maximum lead temperature (soldering 20-40s) 260 c 2 capacitance vs. reverse bias (1 pin to gnd) 0. 0 5. 0 10. 0 15. 0 00 .5 11 .5 22 .5 33 .5 44 .5 5 ca pa ci tan ce ( pf) bi as vo lt ag e (v ) pulse waveform 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 time (s) percent of i pp
?2015 littelfuse, inc. specifcations are subject to change without notice. 554 tvs diode arrays (spa ? diodes) revision: 04/01/15 tvs diode arrays (spa ? diodes) general purpose protection - SP1014 series SP1014 series ti me te mperature t p t l t s(max) t s(min) 25 t p t l t s time to peak temperature preheat p rehea t ramp-up r amp-up ramp-down r amp-d o critical zone t l to t p c ritical zo n e t l to t p refow condition pb C free assembly pre heat - temperature min (t s(min) ) 150c - temperature max (t s(max) ) 200c - time (min to max) (t s ) 60 C 180 secs average ramp up rate (liquidus) temp (t l ) to peak 3c/second max t s(max) to t l - ramp-up rate 3c/second max refow - temperature (t l ) (liquidus) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260 +0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c soldering parameters ordering information part number package marking min. order qty. SP1014-01wtg flipchip ? ? 15000 part numbering system part marking system sp 1014 01 t g series number of channels package t= tape & reel g= green ? w: flipchip tvs diode arrays (spa ? diodes) w 3 0 2 4 6 8 10 12 14 16 18 20 05 10 15 30 tl p cu rren t (a ) tl p vo lt s (v ) 20 25 transmission line pulsing(tlp) plot(1 pin to gnd)
?2015 littelfuse, inc. specifcations are subject to change without notice. 555 tvs diode arrays (spa ? diodes) revision: 04/01/15 tvs diode arrays (spa ? diodes) general purpose protection - SP1014 series SP1014 series 4 embossed carrier tape & reel specifcation flipchip 7 symbol millimeters a0 0.34+/-0.03 b0 0.60+/-0.03 k0 0.25 + 0.03 f 3.50 +/- 0.05 p1 2.00+/-0.10 w 8.00+/-0.10 package dimensions flipchip symbol flipchip millimeters inches min ty p max min ty p max a 0.183 0.211 0.239 0.0072 0.0083 0.0094 a1 0.008 0.011 0.014 0.0003 0.0004 0.0006 a2 0.175 0.200 0.225 0.0069 0.0079 0.0089 d 0.280 0.290 0.300 0.0110 0.0114 0.0118 e 0.530 0.540 0.550 0.0209 0.0213 0.0217 f - 0.100 - - 0.0039 - g - 0.200 - - 0.0079 - top view bottom view a1 a2 a e d d g f 0.20 reco mmen ded so ld er pad foot pr in t and stencil opening *s iz es in mm 0.41 stencil opening (0.20x0.16) solder pad (0.20x0.14) 0.16 0.25 thickness of stencil opening is 0.08mm 0.20 0.14 0.01 top view bottom view a1 a2 a e d d g f 0.20 reco mmen ded so ld er pad foot pr in t and stencil opening *s iz es in mm 0.41 stencil opening (0.20x0.16) solder pad (0.20x0.14) 0.16 0.25 thickness of stencil opening is 0.08mm 0.20 0.14 0.01


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